Join Raytheon as a Semiconductor Backside Via Process Lead where you'll drive innovation in microelectronics processing, leading improvements in production efficiency and product yield. Collaborate with cross-functional teams to address technical challenges on the foundry floor and enhance semiconductor fabrication processes.
Key Responsibilities
Sustain current deposition production processes and develop new processes
Set and report center priorities at the 8am foundry tier meeting
Identify process improvement opportunities
Lead 8Ds and RCCAs
Create and maintain work instructions
Assist in training users and operators on semiconductor processes and equipment
Manipulate large datasets and use statistical analysis
Develop and report on deposition work center health metrics
Identify capital needs and assist in tool acceptance
Interact with various engineering and operations teams
Required Qualifications
Degree in Science, Technology, Engineering or Mathematics (STEM)
Minimum of 8 years of relevant experience or an advanced degree with minimum 5 years’ experience
Experience in semiconductor processing techniques including photolithography and dry etching
Ability to obtain and maintain a U.S. security clearance
Preferred Qualifications
Knowledge of multidisciplinary semiconductor processes
Excellent communication skills
Broad knowledge related to semiconductor processing and data analysis
Experience troubleshooting fabrication equipment
Experience in data analysis software packages (e.g. MATLAB, Python, SQL, JMP)
Ability to lead and coordinate technical projects
Benefits & Perks
Medical, dental, vision insuranceLife insuranceShort-term and long-term disability401(k) matchFlexible spending accountsFlexible work schedulesEmployee assistance programEmployee Scholar ProgramParental leavePaid time offHolidays