Join Raytheon as a Principal Design Engineer in the microelectronics field. Collaborate with multi-disciplined engineers to design and document printed circuit boards, while supporting engineering customers and ensuring design requirements are met. This role offers the opportunity to work on meaningful projects that enhance national security.
Key Responsibilities
Design and document printed circuit boards (PCBs) from conception to manufacturing for RF applications
Create PCB, Circuit Card Assembly (CCA), and Schematic drawings for suppliers
Interface with various engineering disciplines to ensure design requirements are met
Support engineering customers affiliated with home department
Required Qualifications
Bachelor’s degree in Science, Technology, Engineering or Mathematics (STEM)
Minimum 10 years of direct related experience in the microelectronics field
Experience in Schematic Capture, Component Placement, Routing of Traces
Proficiency in Siemens Mentor Graphics and BluePrint software
Design layout experience including Rigid, Flex, and Rigid-Flex assemblies
Experience with Analog, Digital including DDR, RF, Power, and mixed signal technology
Ability to obtain and maintain a U.S. government issued security clearance
Preferred Qualifications
Familiarity with IPC 6012 & IPC 6013
Knowledge of military and commercial design standards, GD&T techniques
Strong communication and presentation skills
Self-starter with ability to work autonomously
Proactivity in discipline and beyond
Ability to effectively multi-task
Ability to understand and interpret drawings related to PCB’s and CCA’s
Benefits & Perks
Medical, dental, vision insuranceLife insuranceShort-term and long-term disability401(k) matchFlexible spending accountsFlexible work schedulesEmployee assistance programEmployee Scholar ProgramParental leavePaid time offHolidays